Effect of Thermal Conductive Pads on Power Supply

With the development of science and technology, power supply tends to be compact and small, so the stability of the power supply needs higher requirements. In normal use most electronic components generate heat, is unavoidable and quite normal. Kept below a reasonable level, temperature will have little effect on the performance or life of a component or circuit. However, if a component operates either periodically or permanently outside its specified temperature envelope (and appropriate thermal management is not put in place) then a dramatic shortening of its useful life or immediate/latent failure can occur. In order to prevent moisture, dust and harmful gas damage to electronic components, thermal conductive sealant is needed to reduce the adverse effects for power supply.

In recent years thermal conductive sealant have become a knight in shining armour for engineers tasked with solving unwanted thermal issues related to innovative, high-functionality designs.

Thermal conductive sealant for power supply is AB two-component, thermal conductive, fire resistant. It is liquid conductive sealant that specially designed for electrical components. Thermal conductive sealant is a material in low viscosity anci composed of double components with excellent fluidity and stability. It has excellent heat resistance and thermal conductivity after curing.

thermal conductive sealant

Air dissipation performance is generally worse than thermal conductive sealant. High power components can not just depend on air, heat can not be timely dissipated. Local high temperature may damage components, thus affecting the system reliability and normal operation. So careful selection of thermal conductive sealant on power supply is very important.