The Thermal Conductivity's Influences of Thermal Interface Material (TIM)

A thermal interface material (TIM) with the highest thermal conductivity does not automatically deliver the best thermal management performance. It is just as important to achieve the best surface contact between TIM and various substrates. Softer interface materials like silicone gap fillers tend to lower contact resistance and thermal impedance. More importantly, the low modulus of silicone gap fillers also decreases the stress due to the large mismatch of the coefficient of thermal expansion (CTE) in microelectronic packages with die chips, heat sinks, heat spreaders, and substrates. However, decreasing the modulus of the gap fillers is often associated with increased creep behavior under compression as well as poor recovery upon removal of the stress. The desired thermal gap fillers must remain elastic at low temperatures and keep thermal stability at high temperatures while still maintaining good thermal conductivity. 

Exceptionally soft, highly compressible gap filler

SinoGuide TCP series Silicone Gap Pad is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 1-8.0 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
Features and Benefits:

◇Thermal Conductivity: 1~8.0W/m.k
◇ Fiberglass Reinforcement or not
◇ Naturally tacky on one side or two side for easy assembly
◇ Electrically insulating
◇ Resist to puncture, shear and tear